(1) the mold contour drawing area is too large, resulting in cracks or breaking the mold. A crack or crack most is what happened some stress release. In any material layout, internal stress is inevitable and wire drawing occurs when the internal stress of the original to enhance diamond microcrystalline structure, but when the drawing surface shrinkage is too large, can not and time slip and temperature rise too high will cause diamond die marked some material is removed, and microcrystalline structure stress greatly add to make it more simple cracked or broken.
(2) wire tensile axis and the die hole center line asymmetry, resulting in of wire and wire drawing die should be force effect is not uniform, and mechanical vibration impact will of wire rod and wire drawing die constitute a high peak stress, both will speed up the mold of wear and tear.
(3) the hardness of the wire caused by uneven annealing is not uniform, and the hardness of the diamond wire drawing dies is not uniform, so the fatigue damage of the diamond wire drawing die prematurely, and the ring groove is formed, and the wear of the die hole is aggravated.
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